OM
V5 Wafer-Level Fully Automated Optical Inspection and Measurement System
Equipment Capabilities
1. Supports 8” to 12” (200 mm to 300 mm) wafer inspection.
2. Handles wafer warpage up to ±7 mm.
3. Macro inspection provides zero-blind-spot detection of defects on both the wafer frontside and backside.
4. Micro inspection offers six magnification levels — 2X, 5X, 10X, 20X, 50X, and 100X — with a resolution range of 0.55 µm to 2.75 µm.
5. Ensures measurement stability for Bump CD, Line Width, Overlay, EBR, and WEE within ±1 pixel deviation.
6.Multi-functional configuration meets all quality assurance requirements.
7. Supports both online and offline review software.
8. Inspection results can be exported in KLARF or SINF format, including backside-to-frontside defect coordinate mapping.
9. FAB automation support (OHT + SECS/GEM).
10. AI ADC software (optional).
1. Supports 8” to 12” (200 mm to 300 mm) wafer inspection.
2. Handles wafer warpage up to ±7 mm.
3. Macro inspection provides zero-blind-spot detection of defects on both the wafer frontside and backside.
4. Micro inspection offers six magnification levels — 2X, 5X, 10X, 20X, 50X, and 100X — with a resolution range of 0.55 µm to 2.75 µm.
5. Ensures measurement stability for Bump CD, Line Width, Overlay, EBR, and WEE within ±1 pixel deviation.
6.Multi-functional configuration meets all quality assurance requirements.
7. Supports both online and offline review software.
8. Inspection results can be exported in KLARF or SINF format, including backside-to-frontside defect coordinate mapping.
9. FAB automation support (OHT + SECS/GEM).
10. AI ADC software (optional).